Bonding Machine
Hign-Frequency Bonding Machine
Automatic PCB Bonding Machine
Product Specifications
| No. | Project | Technical parameters | |
| 1 | Overall dimension (L * W * H) mm | 2250mm (L) x 1400mm(W) x 1800mm(H) | |
| 2 | Equipment weight (Kg) | About1000kg | |
| 3 | Power source（KW） | AC380V, 50~60Hz, 3P | |
| 4 | Maximum power consumption（KW） | 4KW | |
| 5 | Effective processing range（mm） | Min:250*300mmMax:635*736.5mm | |
| 6 | Processing thickness（mm） | ≤10mm | |
| 7 | Production speed（m/min） | 6-layer board calculation (2PNL/min)8–layer board calculation (1.5 PNL/min) | |
| 8 | Equipment capacity | 1. 143/4=36/3600/H÷36=100/H100/H*20H/=2000/*85%≈1700/1. Time 143 seconds/4 sets=36 seconds/set3600 seconds/H ÷ 36 seconds=100 sets/H100 sets/H * 20H/day=2000 sets/day * 85% utilization rate ≈1700 sets/day | |
| 9 | Alignment accuracy | ±1mil | |
| 10 | Fusion head configuration | 8 groups in total (4 groups on each long side) | |
| 11 | Locate the PIN size | Round PIN: D3.175 + 0/-0.01 mm | |
| 12 | Locate the PIN number | 8 total sliding PINs; 4 PINs/table | |
| 13 | Thickness of core board | 0.05—1.0mm | |
| 14 | Number of countertops | Upper and lower double table (alternate operation) | |
| 15 | Heating mode | High frequency electromagnetic wave heating | |
| 16 | Position adjustment mode | Manual independent position adjustment mode of four-side fusion head | |
| 17 | Control mode | Each group of fusion heads is independently controllable | |
| 18 | Fusing head point dimensions | W5-8 * L21mm (grid)(The tooling diagram is compatible with the punching machine) | |
| 19 | Air/ventilation | Gas 6-7 kg/cm2; Exhaust: 25m³/H | |
| 20 | Heating range | Room temperature ~ 320 ℃ | |
| 21 | Table top exchange operation time | Within 3 seconds | |
| 22 | Alarm | Tri-color light/buzzer | |
| 23 | Real-time production records | Data monitoring, display and production record | |