Plasma Cleaning Etching System
Plasma Desmear Machine
PCB Plasma Etching Equipment
Product Specifications
| No. | Project | Technical parameters | |
| 1 | Overall dimension (L * W * H) mm | 1860mm*1470mm*2000mm | |
| 2 | Equipment weight (Kg) | 2550Kg | |
| 3 | Power source | 3PH-AC380V+N+PE, 50/60Hz | |
| 4 | Circuit breaker/main switch A | 40A | |
| 5 | Total power of equipment | 30KW | |
| 6 | RF power supply power, frequency | 10KW @ 40KHZ | |
| 7 | Electrode distribution | Vertically distributed, with each electrode cooled independently | |
| 8 | Number of electrodes | 16 pcs | |
| 9 | Flow controller | Warwick | |
| 10 | Standard configuration 3-way gas | One channel 2000 sccms, two channels 5000 sccms | |
| 11 | Software control system | Chinese and English interface | |
| 12 | Brand of vacuum pump system | Edwards | |
| 13 | RF RF power supply | AE | |
| 14 | Pumping speed capacity | 1160 m3/hPumping capacity 1160 m3/H | |
| 15 | Vacuum working pressure | Working pressure at intake oxygen flow of 2.0-2.5L/minControllable range 180-300mTorr | |
| 16 | Maximum size of production board | 27 X44 inch (22 * 27 inch 30 pieces/furnace) | |
| 17 | Standard production board thickness | 0.03-9 mm (customized soft board fixture is required for thin board below 0.5) | |
| 18 | Minimum size of production board | 4 X 4inch | |