Inner layer line LDI single equipment
Inner Layer LDI Machine
High-speed PCB Inner Layer Laser Direct Imaging
Product Specifications
| No. | Project | Technical parameters | |
| 1 | Dimensions (L * W * H)mm | 3000mm（L）*1912mm（W）*1798mm（H） | |
| 2 | Equipment weight (Kg) | LDI 4.5T | |
| 3 | Power source | 380VAC 50Hz | |
| 4 | Maximum power consumption KW | 15KW | |
| 5 | Effective processing range mm | Min:250mm*300mm Max:630mm*810mm | |
| 6 | Processing thickness mm | 0.05mm(Excluding copper thickness)-5mm(copper thickness) | |
| 7 | Equipment capacity | 3 panels/min(622*546mm;Dry film Exposure Dose≤50mj/cm2;Four-point Alignment,upper and lower boards ≤ 5S) | |
| 8 | Outer layer alignment accuracy | ±12μm | |
| 9 | Inner layer alignment accuracy | 24um | |
| 10 | Dimension uniform | ±10% | |
| 11 | Resolution capability | 55/55um(Limit Resolution 35um/35um) Allowance: ±10% | |